Everspin has expanded its high-reliability xSPI STT-MRAM portfolio with new 128Mb and 256Mb products, and has confirmed production qualification for its 64Mb device.
Its 64Mb high-reliability xSPI STT-MRAM has completed full production qualification to the AEC-Q100 Grade 1 specification. Inventory is available now, and the part is ready for high-volume production programmes through authorised distributors.
MRAM is a form of non-volatile memory positioned for systems that need data retention after power loss and consistent behaviour over long service lives. Everspin sells MRAM into industrial and automotive electronics, as well as aerospace and defence.
Qualification timeline
Everspin set out a staged timeline for higher-density devices in the xSPI STT-MRAM family. The 128Mb product is expected to complete production qualification in May 2026, followed by the 256Mb version in July 2026.
For the top density, volume availability of the 256Mb device is expected in the second half of 2026.
The 64Mb device is part of Everspin's PERSYST xSPI STT-MRAM line, which it describes as a high-reliability portfolio. AEC-Q100 Grade 1 places it within an established automotive qualification framework, typically aligned with operating temperatures associated with under-bonnet and other harsh automotive environments.
Density expansion
The addition of 256Mb extends the family beyond the capacities that have been the focus of many MRAM deployments. The higher density enables higher-capacity persistent memory designs while staying within the same xSPI-based architecture.
For system designers, changes in memory density can affect board layouts, software configuration, qualification work and long-term sourcing strategies. Suppliers in automotive and aerospace often emphasise stable form factors and interface choices, given multi-year development cycles and long field deployments.
Everspin framed the update as progress against its roadmap and a response to customer requirements for predictable performance in long-lifecycle designs.
"Advancing our high-reliability product family through production qualification and expanding density options reflects steady progress against our technology roadmap," said Sanjeev Aggarwal, President and CEO of Everspin. "Customers designing long-lifecycle systems require validated memory solutions with predictable performance, and we are extending the PERSYST platform to meet those needs across a wider range of densities."
Target markets
Everspin cited aerospace, defence, automotive and industrial as target markets for the high-reliability MRAM line. These sectors often demand extended operating temperature ranges and resilience in harsh conditions. Programmes in these categories also tend to place weight on qualification milestones and the ability to maintain supply over long periods.
Everspin also included a customer statement from Astro Digital, which works in the space sector, linking production qualification to confidence for long-term deployments in space and satellite programmes.
"Production qualification provides the level of confidence required for space and satellite programs moving into long-term deployment," said Billy Wahng, Chief Technology Officer at Astro Digital. "Everspin's focus on endurance, data integrity and radiation tolerance addresses the challenges of operating in unpredictable environments."
Everspin said the latest milestones reflect continued execution of its plan to broaden its high-reliability MRAM range for mission-critical applications, with the 128Mb and 256Mb devices expected to move through final qualification phases on the stated schedule.